Author of the publication

Characterizing I/O and Storage Activity on the K Computer for Post-Processing Purposes.

, , , , and . ISCC, page 730-735. IEEE, (2018)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

An In-Situ Visualization Approach for the K Computer Using Mesa 3D and KVS., , , , and . ISC Workshops, volume 11203 of Lecture Notes in Computer Science, page 310-322. Springer, (2018)Analysis of Cooling Water Temperature Impact on Computing Performance and Energy Consumption., , and . CLUSTER, page 169-175. IEEE, (2020)The Impact of Parallel Programming Interfaces on the Aging of a Multicore Embedded Processor., , , , , , , , , and . ISCAS, page 1-5. IEEE, (2019)Showing Ultra-High-Resolution Images in VDA-Based Scalable Displays., , , , , and . CDVE, volume 11792 of Lecture Notes in Computer Science, page 116-122. Springer, (2019)View-independent Texture Representation for Omnidirectional Display., , , , and . Computer Graphics and Imaging, page 135-140. IASTED/ACTA Press, (2003)234 scheduling of 3-2 and 2-1 eliminations for parallel image compositing using non-power-of-two number of processes., , and . HPCS, page 421-428. IEEE, (2015)Data I/O management approach for the post-hoc visualization of big simulation data results., , , , , , and . Int. J. Model. Simul. Sci. Comput., 9 (3): 1840006:1-1840006:16 (2018)HIVE: A cross-platform, modular visualization framework for large-scale data sets., , , , , and . Future Gener. Comput. Syst., (2020)Modeling the Existing Cooling System to Learn its Behavior for Post-K Supercomputer at RIKEN R-CCS., , , , , and . ICPP Workshops, page 6:1-6:10. ACM, (2019)Distributed Particle-Based Rendering Framework for Large Data Visualization on HPC Environments., , , , , and . HPCS, page 300-307. IEEE, (2017)