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Reconfigurable Intelligent Surface: Power Consumption Modeling and Practical Measurement Validation.

J. Wang, W. Tang, J. Liang, L. Zhang, J. Dai, X. Li, S. Jin, Q. Cheng, and T. Cui. CoRR, (2022)

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Jun-Hui Cui

Tie Di

Keqiang Cui

Huiling Cui

Yifang Cui

Other publications of authors with the same name

A SAR raw echo signal simulator for terrain surface.X. Qin, H. Chen, and T. Cui. IGARSS, page 1110-1113. IEEE, (2016)Fast algorithm for electromagnetic scattering by buried 3-D dielectric objects of large size.T. Cui, and W. Chew. IEEE Trans. Geosci. Remote. Sens., 37 (5): 2597-2608 (1999)Correction to: "Novel diffraction tomographic algorithm for imaging two-dimensional targets buried under a lossy earth".T. Cui, and W. Chew. IEEE Trans. Geosci. Remote. Sens., 39 (2): 461 (2001)Fast evaluation of Sommerfeld integrals for EM scattering and radiation by three-dimensional buried objects.T. Cui, and W. Chew. IEEE Trans. Geosci. Remote. Sens., 37 (2): 887-900 (1999)Electromagnetic scattering by multiple three-dimensional scatterers buried under multilayered media. I. Theory.T. Cui, W. Wiesbeck, and A. Herschlein. IEEE Trans. Geosci. Remote. Sens., 36 (2): 526-534 (1998)MIMO Transmission Through Reconfigurable Intelligent Surface: System Design, Analysis, and Implementation.W. Tang, J. Dai, M. Chen, K. Wong, X. Li, X. Zhao, S. Jin, Q. Cheng, and T. Cui. IEEE J. Sel. Areas Commun., 38 (11): 2683-2699 (2020)Observation of a higher-order end topological insulator in a real projective latticeC. Shang, S. Liu, C. Jiang, R. Shao, X. Zang, C. Lee, R. Thomale, A. Manchon, T. Cui, and U. Schwingenschlögl. Adv. Sci., (Jan 12, 2024)Modeling and Measurements for Multi-path Mitigation with Reconfigurable Intelligent Surfaces.R. Zhou, X. Chen, W. Tang, X. Li, S. Jin, E. Basar, Q. Cheng, and T. Cui. CoRR, (2021)Reconfigurable Intelligent Surfaces: Channel Characterization and Modeling.J. Huang, C. Wang, Y. Sun, R. Feng, J. Huang, B. Guo, Z. Zhong, and T. Cui. Proc. IEEE, 110 (9): 1290-1311 (2022)Several Types of Antennas Composed of Microwave Metamaterials.T. Cui, X. Zhou, X. Yang, W. Jiang, Q. Cheng, and H. Ma. IEICE Trans. Commun., 94-B (5): 1142-1152 (2011)

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Disambiguation of "Cui, Tie Jun"

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Reconfigurable Intelligent Surface: Power Consumption Modeling and Practical Measurement Validation.

Please choose a person to relate this publication to

Jun-Hui Cui

Tie Di

Keqiang Cui

Huiling Cui

Yifang Cui

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Cui, Tie Jun"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Reconfigurable Intelligent Surface: Power Consumption Modeling and Practical Measurement Validation.

Please choose a person to relate this publication to

Jun-Hui Cui

Tie Di

Keqiang Cui

Huiling Cui

Yifang Cui

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Reconfigurable Intelligent Surface: Power Consumption Modeling and Practical Measurement Validation.