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Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress.

, , , , and . Sensors, 19 (18): 3979 (2019)

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Fabrication of The Multi-PCR Chamber With Inner Heat-Sink Materials Using a Micro-Blaster Etching Technique., , , , , and . ICMENS, page 301-306. IEEE Computer Society, (2005)Characterization of Total-Phosphorus (TP) Pretreatment Microfluidic Chip Based on a Thermally Enhanced Photocatalyst for Portable Analysis of Eutrophication., , and . Sensors, 19 (16): 3452 (2019)WiLD: Widening view angle for lesion detection with gastroscopic images., , , , , , , and . ICC, page 1-6. IEEE, (2016)Fabrication and performance analysis of an amorphous silicon-based thermal IR detector., , , , , , , , and . NEMS, page 696-699. IEEE, (2010)Tunable Fabry-Perot Interferometer Designed for Far-Infrared Wavelength by Utilizing Electromagnetic Force., , , , and . Sensors, 18 (8): 2572 (2018)Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress., , , , and . Sensors, 19 (18): 3979 (2019)A Lab-on-a-Chip-Based Non-Invasive Optical Sensor for Measuring Glucose in Saliva., , and . Sensors, 17 (11): 2607 (2017)Spectral performance of a micromachined infrared spectrum analyzer in silicon., and . IEEE Trans. Instrum. Meas., 54 (1): 264-267 (2005)Sensitivity and Frequency-Response Improvement of a Thermal Convection-Based Accelerometer., , , , , , and . Sensors, 17 (8): 1765 (2017)Fabrication of Organic/Inorganic LED device using nanocrystal quantum dots as active layer., , , , , , , , , and . NEMS, page 832-835. IEEE, (2010)