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Disambiguation of "Dasgupta, A."

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Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires.

, , , and . Microelectron. Reliab., 49 (5): 523-529 (2009)

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Shivaji Dasgupta

Shyamal Dasgupta

Subho Dasgupta

Subhoranjan Dasgupta

Subrata Dasgupta

 

Other publications of authors with the same name

Identification of a Box-Jenkins structured two stage cascaded model using Simplex Particle Swarm Optimization algorithm., , , , , and . ISPACS, page 1-4. IEEE, (2016)Quadratic stabilization of a class of linear systems and its application to robot control., and . Int. J. Systems Science, 29 (3): 267-274 (1998)GW190521: A Binary Black Hole Merger with a Total Mass of $150 ~ M_ødot$, , , , , , , , , and 1247 other author(s). (2020)cite arxiv:2009.01075Comment: Supplementary Material at https://dcc.ligo.org/LIGO-P2000020/Public.The heat equation and Stein's identity: Connections, applications, , , and . Journal of Statistical Planning and Inference, 136 (7): 2254--2278 (Jul 1, 2006)Estimation of binomial parameters when both n, p are unknown, and . Journal of Statistical Planning and Inference, 130 (1-2): 391--404 (Mar 1, 2005)Open64 compiler infrastructure for emerging multicore/manycore architecture All Symposium Tutorial., , , , and . IPDPS, page 1. IEEE, (2008)Interval Estimation for a Binomial Proportion (with discussion), , and . Statistical Science, 16 (2): 101--133 (2001)Position and force control of robotic devices interacting with passive environments through compliance modulation.. Int. J. Systems Science, 30 (7): 697-705 (1999)Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs., , , , , , and . Microelectron. Reliab., 50 (7): 937-947 (2010)Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires., , , and . Microelectron. Reliab., 49 (5): 523-529 (2009)