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Energy-Efficient Multiprocessor Systems-on-Chip for Embedded Computing: Exploring Programming Models and Their Architectural Support.

, , , , , , and . IEEE Trans. Computers, 56 (5): 606-621 (2007)

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Energy/area/delay trade-offs in the physical design of on-chip segmented bus architecture., , , and . SLIP, page 75-81. ACM, (2006)3D integration: Circuit design, test, and reliability challenges., , , , , , , , and . IOLTS, page 217. IEEE Computer Society, (2010)Architectures and Circuits for Software-Defined Radios: Scaling and Scalability for Low Cost and Low Energy., , , , , , , , , and 3 other author(s). ISSCC, page 568-569. IEEE, (2007)In-tier diagnosis of power domains in 3D TSV ICs., , , , , , , , , and 1 other author(s). 3DIC, page 1-6. IEEE, (2011)Design issues in heterogeneous 3D/2.5D integration., , , , , and . ASP-DAC, page 403-410. IEEE, (2013)A calibrated pathfinding model for signal integrity analysis on interposer., , , , , and . CICC, page 1-4. IEEE, (2012)Editorial- three-dimensional integrated circuits design., and . IET Comput. Digit. Tech., 5 (3): 159 (2011)3D heterogeneous system integration: application driver for 3D technology development., , and . DAC, page 213. ACM, (2011)3-D stacked die: now or future?, , , , , , , and . DAC, page 298-299. ACM, (2010)Design issues and considerations for low-cost 3D TSV IC technology., , , , , , , , , and 24 other author(s). ISSCC, page 148-149. IEEE, (2010)