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Impact of Non-Conducting HCI Degradation on Small-Signal Parameters in RF SOI MOSFET., , , , , , and . IRPS, page 1-6. IEEE, (2023)Transmission line characterization for high frequency synchronization systems design., , and . CONIELECOMP, page 43-47. IEEE, (2010)Analysis of the effects of coupling through substrate and the calculus of the Q factor., , , , and . LASCAS, page 1-4. IEEE, (2013)Modeling Passive Devices for CMOS RF Circuits., , and . MIXDES, page 20-24. IEEE, (2021)Assessing Non-Conducting Off-State Induced Hard Breakdown for PD-SOI MOSFETs using an RF Measurement Technique., , , , , and . IRPS, page 53. IEEE, (2024)Characterization and modeling of on-chip via stacks for RF-CMOS applications., , , and . IEICE Electron. Express, 17 (4): 20190735 (2020)Characterization of transmission lines in a novel high-frequency laminate., , , and . LASCAS, page 391-394. IEEE, (2016)Novel PCB fabrication process roughness free for high frequency applications., , and . CCE, page 1-3. IEEE, (2015)Assessment of Performance of One-Turn Inductors in Series Configuration Through a Transmission-Line Modeling Approach., , , and . IEEE Access, (2024)