( en | de | ru )

 

Disambiguation of "Hettrich, Horst"

Author of the publication

copydeleteadd this publication to your clipboard
Broadband plasmonic modulator enabling single carrier operation beyond 100 Gbit/s.

, , , , , , , , , , , , , and . OFC, page 1-3. IEEE, (2017)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Heinrich Hettrich

Wieland Hettrich

Kay Hettrich

Heinrich Hettrich

Ralph Hettrich

 

Other publications of authors with the same name

Broadband plasmonic modulator enabling single carrier operation beyond 100 Gbit/s., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2017)120 GSa/s BiCMOS Analog Multiplexer Enabling 360 Gbit/s DSCM-PCS-256QAM IM/DD Transmission., , , , , , , and . OFC, page 1-3. IEEE, (2021)100 GSa/s BiCMOS Analog Multiplexer Based 100 GBd PAM Transmission over 20 km Single-Mode Fiber in the C-Band., , , , , , , , and . ECOC, page 1-4. IEEE, (2020)High-speed IM/DD transmission with analog (de-)multiplexers., , , , , , , , , and 3 other author(s). ECOC, page 1-4. IEEE, (2021)Design Considerations for a 100 Gbit/s SiGe-BiCMOS Power Multiplexer With 2 Vpp Differential Voltage Swing., , and . IEEE J. Solid State Circuits, 53 (9): 2479-2487 (2018)Dual-Drive Plasmonic Transmitter with Co-Designed Driver Electronics operated at 120 GBd On-Off Keying., , , , , , , , , and 3 other author(s). OFC, page 1-3. IEEE, (2019)52.1 Tb/s C-band DCI transmission over DCI distances at 52.1 Tb/s C-Band DCI Transmission over DCI Distances at 1.49 Tb/s/λ.49 Tbsλ., , , , , , and . ECOC, page 1-4. IEEE, (2020)Low-Power Data Center Transponders Enabled by Micrometer-Scale Plasmonic Modulators., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2020)Scaling Optical Interconnects Beyond 400 Gb/s., , , , , , , , , and 11 other author(s). ECOC, page 1-3. IEEE, (2018)Design Considerations for a 11.3 Gbit/s SiGe Bipolar Driver Array With a 5 × 6 Vpp Chip-to-Chip Bondwire Output to an MZM PIC., and . IEEE J. Solid State Circuits, 51 (9): 2006-2014 (2016)