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A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration., , , , , , , , , и 4 other автор(ы). 3DIC, стр. 1-5. IEEE, (2009)Tongue-tied?: An active analysis of Brian Friel’s Translations. Studies in Theatre and Performance, 32 (1): 47--60 (февраля 2012)Realizing the strategic potential of e-HRM., и . J. Strateg. Inf. Syst., 22 (3): 187-192 (2013)Feasibility of Single-Beam Interference Alignment in Multi-Carrier Interference Channels., и . IEEE Trans. Inf. Theory, 63 (11): 7352-7357 (2017)Perturb+mutate: Semisynthetic circuit generation for incremental placement and routing., и . ACM Trans. Reconfigurable Technol. Syst., 1 (3): 16:1-16:24 (2008)A CAD framework for Malibu: an FPGA with time-multiplexed coarse-grained elements., , и . FPGA, стр. 123-132. ACM, (2011)A High-Speed Integrated Hamming Neural Classifier., , и . ISCAS, стр. 479-482. IEEE, (1994)Evaluation of non-destructive etch depth measurement for through silicon vias., , , и . ICICDT, стр. 1-4. IEEE, (2012)Finding Similar Failures Using Callstack Similarity., , , , , , и . SysML, USENIX Association, (2008)The equivalence of space-time codes and codes defined over finite fields and Galois rings., и . Adv. in Math. of Comm., 2 (2): 131-145 (2008)