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Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.

, , , , , , , , , , and . 3DIC, page TS8.25.1-TS8.25.5. IEEE, (2015)

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Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module., , , , , and . 3DIC, page TS2.2.1-TS2.2.4. IEEE, (2015)Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling., , , , , , , and . EMC Compo, page 5-9. IEEE, (2013)A Study on the Election of Suitable Leader Vehicle in Vehicle Platooning Using the Raft Algorithm., , and . ICUFN, page 756-761. IEEE, (2019)Eye-diagram simulation and analysis of a high-speed TSV-based channel., , , , , , , and . 3DIC, page 1-7. IEEE, (2013)Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC., , , , , , , , , and 1 other author(s). 3DIC, page TS8.25.1-TS8.25.5. IEEE, (2015)A Study on the Selection of Candidate Leaders for flexible Platooning in Urban Road., , and . ICUFN, page 725-728. IEEE, (2019)TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC., , , , , , and . EMC Compo, page 212-215. IEEE, (2015)Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC., , , , , , and . EMC Compo, page 248-251. IEEE, (2015)