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A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes.

, , , , , , , , , , и . ISSCC, стр. 186-188. IEEE, (2018)

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Emile Schyns

Emile Paes

Emile Nosseir

Emile Cherbuliez

Emile Schmoetten

 

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A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes., , , , , , , , , и 1 other автор(ы). ESSCIRC, стр. 211-214. IEEE, (2017)A Pitch-Matched High-Frame-Rate Ultrasound Imaging ASIC for Catheter-Based 3-D Probes., , , , , , , , , и 2 other автор(ы). IEEE J. Solid State Circuits, 59 (2): 476-491 (февраля 2024)A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays., , , , , , , и . ESSCIRC, стр. 163-166. IEEE, (2021)Design of an Ultrasound Transceiver ASIC with a Switching-Artifact Reduction Technique for 3D Carotid Artery Imaging., , , , , , , , , и . Sensors, 21 (1): 150 (2021)A Transceiver ASIC for a Single-Cable 64-Element Intra-Vascular Ultrasound Probe., , , , , , , и . IEEE J. Solid State Circuits, 56 (10): 3157-3166 (2021)A Pitch-Matched Transceiver ASIC With Shared Hybrid Beamforming ADC for High-Frame-Rate 3-D Intracardiac Echocardiography., , , , , , , , , и 1 other автор(ы). IEEE J. Solid State Circuits, 57 (11): 3228-3242 (2022)A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes., , , , , , , , , и 1 other автор(ы). ISSCC, стр. 494-496. IEEE, (2022)A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes., , , , , , , , , и 1 other автор(ы). ISSCC, стр. 186-188. IEEE, (2018)A Tiled Ultrasound Matrix Transducer for Volumetric Imaging of the Carotid Artery., , , , , , , , , и 2 other автор(ы). Sensors, 22 (24): 9799 (2022)A 1.2mW/channel 100µm-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging., , , , , , , , и . ISSCC, стр. 496-498. IEEE, (2022)