( en | de | ru )

 

Disambiguation of "Gopal, Srinivasan"

Author of the publication

copydeleteadd this publication to your clipboard
A 28GHz 41%-PAE linear CMOS power amplifier using a transformer-based AM-PM distortion-correction technique for 5G phased arrays.

, , , , , and . ISSCC, page 406-408. IEEE, (2018)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Karappurath Gopalan

Kreshna Gopal

Gopal Mamdapurkar

Vijay Gopalakrishnan

R Srinivasan

 

Other publications of authors with the same name

A 28GHz 41%-PAE linear CMOS power amplifier using a transformer-based AM-PM distortion-correction technique for 5G phased arrays., , , , , and . ISSCC, page 406-408. IEEE, (2018)Energy-efficient and robust 3D NoCs with contactless vertical links (Invited paper)., , , and . ICCAD, page 1-6. IEEE, (2017)A Spatial Multi-Bit Sub-1-V Time-Domain Matrix Multiplier Interface for Approximate Computing in 65-nm CMOS., , , , , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 8 (3): 506-518 (2018)Trends and Opportunities for SRAM Based In-Memory and Near-Memory Computation., , , , , , , , , and . ISQED, page 547-552. IEEE, (2021)Inducing Chaos in MOSFET-Based Electronic Circuits., and . CSSP, 28 (4): 535-545 (2009)Making a Case for Partially Connected 3D NoC: NFIC versus TSV., , , , and . ACM J. Emerg. Technol. Comput. Syst., 16 (4): 41:1-41:17 (2020)Analysis of Systematic Losses in Hybrid Envelope Tracking Modulators., , , , and . IEEE Trans. Circuits Syst. I Regul. Pap., 66-I (4): 1319-1330 (2019)A 25-35 GHz Neutralized Continuous Class-F CMOS Power Amplifier for 5G Mobile Communications Achieving 26% Modulation PAE at 1.5 Gb/s and 46.4% Peak PAE., , , , and . IEEE Trans. Circuits Syst. I Regul. Pap., 66-I (2): 834-847 (2019)A 16-Gb/s Low-Power Inductorless Wideband Gain-Boosted Baseband Amplifier With Skewed Differential Topology for Wireless Network-on-Chip., , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 26 (11): 2406-2418 (2018)A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC., , , and . IEEE Trans. Circuits Syst., 67-I (11): 3919-3932 (2020)