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%0 Journal Article
%1 journals/ieiceee/AragaNVPB18
%A Araga, Yuuki
%A Nagata, Makoto
%A Vos, Joeri De
%A der Plas, Geert Van
%A Beyne, Eric
%D 2018
%J IEICE Electron. Express
%K dblp
%N 13
%P 20180460
%T A study on substrate noise coupling among TSVs in 3D chip stack.
%U http://dblp.uni-trier.de/db/journals/ieiceee/ieiceee15.html#AragaNVPB18
%V 15
@article{journals/ieiceee/AragaNVPB18,
added-at = {2021-10-14T00:00:00.000+0200},
author = {Araga, Yuuki and Nagata, Makoto and Vos, Joeri De and der Plas, Geert Van and Beyne, Eric},
biburl = {https://www.bibsonomy.org/bibtex/293351c1fd48cbdaa58241e4eb402bf7e/dblp},
ee = {https://doi.org/10.1587/elex.15.20180460},
interhash = {2f9df8ba94e088c3843c8a68d8f0d8d8},
intrahash = {93351c1fd48cbdaa58241e4eb402bf7e},
journal = {IEICE Electron. Express},
keywords = {dblp},
number = 13,
pages = 20180460,
timestamp = {2024-04-09T06:46:19.000+0200},
title = {A study on substrate noise coupling among TSVs in 3D chip stack.},
url = {http://dblp.uni-trier.de/db/journals/ieiceee/ieiceee15.html#AragaNVPB18},
volume = 15,
year = 2018
}
