%0 Conference Paper %1 conf/3dic/OlmenCDMHJKMRSTBS09 %A Olmen, Jan Van %A Coenen, Jan %A Dehaene, Wim %A Meyer, Kristin De %A Huyghebaert, Cedric %A Jourdain, Anne %A Katti, Guruprasad %A Mercha, Abdelkarim %A Rakowski, Michal %A Stucchi, Michele %A Travaly, Youssef %A Beyne, Eric %A Swinnen, Bart %B 3DIC %D 2009 %I IEEE %K dblp %P 1-5 %T 3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). %U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#OlmenCDMHJKMRSTBS09 %@ 978-1-4244-4512-7

@inproceedings{conf/3dic/OlmenCDMHJKMRSTBS09, added-at = {2021-10-14T00:00:00.000+0200}, author = {Olmen, Jan Van and Coenen, Jan and Dehaene, Wim and Meyer, Kristin De and Huyghebaert, Cedric and Jourdain, Anne and Katti, Guruprasad and Mercha, Abdelkarim and Rakowski, Michal and Stucchi, Michele and Travaly, Youssef and Beyne, Eric and Swinnen, Bart}, biburl = {https://www.bibsonomy.org/bibtex/2189b93bfb347a650f0c3b6a9e96aeb76/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2009}, ee = {https://doi.org/10.1109/3DIC.2009.5306600}, interhash = {e23f44bd780758eb21a029ac191f69e8}, intrahash = {189b93bfb347a650f0c3b6a9e96aeb76}, isbn = {978-1-4244-4512-7}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:49.000+0200}, title = {3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#OlmenCDMHJKMRSTBS09}, year = 2009 }