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3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

J. Olmen, J. Coenen, W. Dehaene, K. Meyer, C. Huyghebaert, A. Jourdain, G. Katti, A. Mercha, M. Rakowski, M. Stucchi, Y. Travaly, E. Beyne, and B. Swinnen. 3DIC, page 1-5. IEEE, (2009)

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Jan van Neerven

Jan van Weeren

Jan van Üüm

Jan van Calker

Jan van Üüm

Other publications of authors with the same name

Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.Y. Yang, R. Labie, F. Ling, C. Zhao, A. Radisic, J. Olmen, Y. Travaly, B. Verlinden, and I. Wolf. Microelectron. Reliab., 50 (9-11): 1636-1640 (2010)Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.G. der Plas, P. Limaye, I. Loi, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti and 27 other author(s). IEEE J. Solid State Circuits, 46 (1): 293-307 (2011)TSV metrology and inspection challenges.R. Alapati, Y. Travaly, J. Olmen, R. Teixeira, J. Vaes, M. van Cauwenbergh, A. Jourdain, G. Verbinnen, G. Marcuccilli, G. Florence and 6 other author(s). 3DIC, page 1-4. IEEE, (2009)Thin-Film Quantum Dot Photodiode for Monolithic Infrared Image Sensors.P. Malinowski, E. Georgitzikis, J. Maes, I. Vamvaka, F. Frazzica, J. Olmen, P. Moor, P. Heremans, Z. Hens, and D. Cheyns. Sensors, 17 (12): 2867 (2017)3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).J. Olmen, J. Coenen, W. Dehaene, K. Meyer, C. Huyghebaert, A. Jourdain, G. Katti, A. Mercha, M. Rakowski, M. Stucchi and 3 other author(s). 3DIC, page 1-5. IEEE, (2009)Design issues and considerations for low-cost 3D TSV IC technology.G. der Plas, P. Limaye, A. Mercha, H. Oprins, C. Torregiani, S. Thijs, D. Linten, M. Stucchi, G. Katti, D. Velenis and 24 other author(s). ISSCC, page 148-149. IEEE, (2010)

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Disambiguation of "Olmen, Jan Van"

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3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

Please choose a person to relate this publication to

Jan van Neerven

Jan van Weeren

Jan van Üüm

Jan van Calker

Jan van Üüm

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Olmen, Jan Van"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML 3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

Please choose a person to relate this publication to

Jan van Neerven

Jan van Weeren

Jan van Üüm

Jan van Calker

Jan van Üüm

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
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3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

Jan van Calker