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3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

J. Olmen, J. Coenen, W. Dehaene, K. Meyer, C. Huyghebaert, A. Jourdain, G. Katti, A. Mercha, M. Rakowski, M. Stucchi, Y. Travaly, E. Beyne, and B. Swinnen. 3DIC, page 1-5. IEEE, (2009)

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Cédric Bodet

Cédric Müller

Cedric Walravens

Cedric Raguenaud

Cédric Allène

Other publications of authors with the same name

3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).J. Olmen, J. Coenen, W. Dehaene, K. Meyer, C. Huyghebaert, A. Jourdain, G. Katti, A. Mercha, M. Rakowski, M. Stucchi and 3 other author(s). 3DIC, page 1-5. IEEE, (2009)Tunneling transistors based on MoS2/MoTe2 Van der Waals heterostructures.Y. Balaji, Q. Smets, C. de la Rosa, A. Lu, D. Chiappe, T. Agarwal, D. Lin, C. Huyghebaert, I. Radu, D. Mocuta and 1 other author(s). ESSDERC, page 106-109. IEEE, (2017)Graphene electro-absorption modulators integrated at wafer-scale in a CMOS fab.C. Wu, S. Brems, D. Yudistira, D. Cott, A. Milenin, K. Vandersmissen, A. Maestre, A. Centeno, J. Campenhout, C. Huyghebaert and 1 other author(s). VLSI Circuits, page 1-2. IEEE, (2021)Broadband 20 Gbit/s Graphene-Si Electro-Absorption Modulator.C. Alessandri, I. Asselberghs, Y. Ban, S. Brems, C. Huyghebaert, J. Campenhout, D. Thourhout, and M. Pantouvaki. ECOC, page 1-3. IEEE, (2018)4-Channel C-Band WDM Transmitter Based on 10 GHz Graphene-Silicon Electro-Absorption Modulators.C. Alessandri, I. Asselberghs, P. Heyn, S. Brems, C. Huyghebaert, J. Campenhout, D. Thourhout, and M. Pantouvaki. OFC, page 1-3. IEEE, (2019)Hybrid graphene-silicon photonics devices.D. Thourhout, Y. Hu, M. Pantouvaki, K. Alexander, B. Kuyken, S. Brems, I. Asselberghs, C. Huyghebaert, C. Alessandri, P. Absil and 1 other author(s). ECOC, page 1-3. IEEE, (2015)WS2 transistors on 300 mm wafers with BEOL compatibility.T. Schram, Q. Smets, B. Groven, M. Heyne, E. Kunnen, A. Thiam, K. Devriendt, A. Delabie, D. Lin, M. Lux and 8 other author(s). ESSDERC, page 212-215. IEEE, (2017)

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Disambiguation of "Huyghebaert, Cedric"

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3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

Please choose a person to relate this publication to

Cédric Bodet

Cédric Müller

Cedric Walravens

Cedric Raguenaud

Cédric Allène

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Huyghebaert, Cedric"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML 3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

Please choose a person to relate this publication to

Cédric Bodet

Cédric Müller

Cedric Walravens

Cedric Raguenaud

Cédric Allène

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).