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Experimental Demonstration of Post-Fabrication Self-Improvement of SRAM Cell Stability by High-Voltage Stress., , , and . IEICE Trans. Electron., 96-C (6): 759-765 (2013)VTCMOS characteristics and its optimum conditions predicted by a compact analytical model., , , , and . ISLPED, page 123-128. ACM, (2001)New Methodology for Evaluating Minority Carrier Lifetime for Process Assessment., , , , , , , , , and 10 other author(s). VLSI Circuits, page 105-106. IEEE, (2018)Parallel nonvolatile programming of power-up states of SRAM cells., , , and . ASICON, page 418-421. IEEE, (2017)Ultra-low-voltage operation: device perspective.. ISLPED, page 59-60. IEEE/ACM, (2011)Emerging nanoscale silicon devices taking advantage of nanostructure physics., , and . IBM J. Res. Dev., 50 (4-5): 411-418 (2006)NBTI Reliability of PFETs under Post-Fabrication Self-Improvement Scheme for SRAM., , , , and . IEICE Trans. Electron., 96-C (5): 620-623 (2013)Device Design of Nanoscale MOSFETs Considering the Suppression of Short Channel Effects and Characteristics Variations., , , and . IEICE Trans. Electron., 90-C (4): 836-841 (2007)A Nanosheet Oxide Semiconductor FET Using ALD InGaOx Channel and InSnOx Electrode with Normally-off Operation, High Mobility and Reliability for 3D Integrated Devices., , , , , , , , , and . VLSI Technology and Circuits, page 1-2. IEEE, (2023)Recent Progress of Double/Dual-Gate Silicon IGBT Technologies., and . ASICON, page 1-4. IEEE, (2021)