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Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes., , , , , , , , and . IRPS, page 1-8. IEEE, (2023)Transistor reliability variation correlation to threshold voltage., , , , , and . IRPS, page 3. IEEE, (2015)Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing., , , , , , , , , and 52 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2023)Novel Re-configurable Circuits For Aging Characterization: Connecting Devices to Circuits., , , , , , , , , and . IRPS, page 1-5. IEEE, (2020)Reliability of dual-damascene local interconnects featuring cobalt on 10 nm logic technology., , , , , , , , , and 4 other author(s). IRPS, page 6. IEEE, (2018)Learn Windows PowerShell in a month of lunches, and . Manning, Shelter Island, New York, (2017)Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel's 10+ Process., , , , , , , , , and 6 other author(s). IRPS, page 1-4. IEEE, (2020)E-Core Implementation in Intel 4 with PowerVia (Backside Power) Technology., , , , , , , , , and 82 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2023)Novel Cell Architectures with Back-side Transistor Contacts for Scaling and Performance., , , , , , , , , and 22 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2023)