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Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.

, , , , , , , , и . Micromachines, 7 (10): 184 (2016)

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Hisashi Saeki

Hisashi Ochi

Asako Kinoshita

Asako Kinoshita

Hisashi Saito

 

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