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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric., , , , , , , , , и . Microelectron. Reliab., 53 (1): 17-29 (2013)MetaSurv: Web-Platform Generator for the Monitoring of Health Indicators and Interactive Geographical Information System., , и . MIE, том 116 из Studies in Health Technology and Informatics, стр. 989-993. IOS Press, (2005)Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding., , , , , , , , , и . 3DIC, стр. 1-8. IEEE, (2014)200°C direct bonding copper interconnects : Electrical results and reliability., , , , , и . 3DIC, стр. 1-4. IEEE, (2011)Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis., , , , , и . IRPS, стр. 1-6. IEEE, (2024)3D interconnection using copper direct hybrid bonding for GaN on silicon wafer., , , , , , , и . 3DIC, стр. 1-4. IEEE, (2021)Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits., , , , , , и . IRPS, стр. 1-7. IEEE, (2023)New Method to Perform TDDB Tests for Hybrid Bonding Interconnects., , , , , , и . IRPS, стр. 4. IEEE, (2022)Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects., , , , и . ISPD, стр. 85-90. ACM, (2024)Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability., , , , , , , , , и 7 other автор(ы). IRPS, стр. 4. IEEE, (2018)