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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

T. Frank, S. Moreau, C. Chappaz, P. Leduc, L. Arnaud, A. Thuaire, E. Chery, F. Lorut, L. Anghel, and G. Poupon. Microelectron. Reliab., 53 (1): 17-29 (2013)

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Henry Anghel

Anghel Rugina

Lorena Maldea

Lorena Schneppel

Ghenadie Anghel

Other publications of authors with the same name

In-situ slack monitors: taking up the challenge of on-die monitoring of variability and reliability.A. Benhassain, S. Mhira, F. Cacho, V. Huard, and L. Anghel. IVSW, page 1-5. IEEE, (2016)Multi-context non-volatile content addressable memory using magnetic tunnel junctions.E. Deng, L. Anghel, G. Prenat, and W. Zhao. NANOARCH, page 103-108. ACM, (2016)Digital circuits reliability with in-situ monitors in 28nm fully depleted SOI.M. Saliva, F. Cacho, V. Huard, X. Federspiel, D. Angot, A. Benhassain, A. Bravaix, and L. Anghel. DATE, page 441-446. ACM, (2015)Hidden-Delay-Fault Sensor for Test, Reliability and Security.G. Natale, E. Vatajelu, K. Kannan, and L. Anghel. DATE, page 316-319. IEEE, (2019)Workload dependent reliability timing analysis flow.A. Sivadasan, A. Notin, V. Huard, E. Maurin, S. Mhira, F. Cacho, and L. Anghel. DATE, page 736-737. IEEE, (2017)Reliability analysis of MTJ-based functional module for neuromorphic computing.E. Vatajelu, and L. Anghel. IOLTS, page 126-131. IEEE, (2017)Adaptive inter-layer message routing in 3D networks-on-chip.C. Rusu, L. Anghel, and D. Avresky. Microprocess. Microsystems, 35 (7): 613-631 (2011)Fault-tolerant adaptive routing under an unconstrained set of node and link failures for many-core systems-on-chip.M. Dimopoulos, Y. Gang, L. Anghel, M. Benabdenbi, N. Zergainoh, and M. Nicolaidis. Microprocess. Microsystems, 38 (6): 620-635 (2014)SpinDrop: Dropout-Based Bayesian Binary Neural Networks With Spintronic Implementation.S. Ahmed, K. Danouchi, C. Münch, G. Prenat, L. Anghel, and M. Tahoori. IEEE J. Emerg. Sel. Topics Circuits Syst., 13 (1): 150-164 (March 2023)CNTFET Modeling and Reconfigurable Logic-Circuit Design.I. O'Connor, J. Liu, F. Gaffiot, F. Prégaldiny, C. Lallement, C. Maneux, J. Goguet, S. Fregonese, T. Zimmer, L. Anghel and 2 other author(s). IEEE Trans. Circuits Syst. I Regul. Pap., 54-I (11): 2365-2379 (2007)

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Disambiguation of "Anghel, Lorena"

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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

Please choose a person to relate this publication to

Henry Anghel

Anghel Rugina

Lorena Maldea

Lorena Schneppel

Ghenadie Anghel

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Anghel, Lorena"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

Please choose a person to relate this publication to

Henry Anghel

Anghel Rugina

Lorena Maldea

Lorena Schneppel

Ghenadie Anghel

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.