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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

T. Frank, S. Moreau, C. Chappaz, P. Leduc, L. Arnaud, A. Thuaire, E. Chery, F. Lorut, L. Anghel, and G. Poupon. Microelectron. Reliab., 53 (1): 17-29 (2013)

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Cédrick Lelionnais

Other publications of authors with the same name

Stress management strategy to limit die curvature during silicon interposer integration.B. Vianne, A. Farcy, V. Fiori, C. Chappaz, N. Chevrier, G. Lobascio, P. Chausse, F. Ponthenier, A. Ruckly, S. Escoubas and 1 other author(s). 3DIC, page TS11.4.1-TS11.4.7. IEEE, (2015)Friction Reduction through Ultrasonic Vibration Part 2: Experimental Evaluation of Intermittent Contact and Squeeze Film Levitation.T. Sednaoui, E. Vezzoli, B. Dzidek, B. Lemaire-Semail, C. Chappaz, and M. Adams. IEEE Trans. Haptics, 10 (2): 208-216 (2017)Development of Embedded Three-Dimensional 35-nF/mm2 MIM Capacitor and BiCMOS Circuits Characterization.J. Giraudin, F. Badets, J. Blanc, E. Chataigner, C. Chappaz, J. Regolini, and P. Delpech. IEEE J. Solid State Circuits, 42 (9): 1842-1850 (2007)Psychophysical Power Optimization of Friction Modulation for Tactile Interfaces.T. Sednaoui, E. Vezzoli, D. Gueorguiev, M. Amberg, C. Chappaz, and B. Lemaire-Semail. EuroHaptics (2), volume 9775 of Lecture Notes in Computer Science, page 354-362. Springer, (2016)200°C direct bonding copper interconnects : Electrical results and reliability.L. Cioccio, R. Taibi, C. Chappaz, S. Moreau, L. Chapelon, and T. Signamarcheix. 3DIC, page 1-4. IEEE, (2011)Experimental evaluation of friction reduction in ultrasonic devices.T. Sednaoui, E. Vezzoli, B. Dzidek, B. Lemaire-Semail, C. Chappaz, and M. Adams. World Haptics, page 37-42. IEEE, (2015)Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.T. Frank, S. Moreau, C. Chappaz, P. Leduc, L. Arnaud, A. Thuaire, E. Chery, F. Lorut, L. Anghel, and G. Poupon. Microelectron. Reliab., 53 (1): 17-29 (2013)

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Disambiguation of "Chappaz, Cédrick"

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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

Please choose a person to relate this publication to

Cédrick Lelionnais

Other publications of authors with the same name

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Disambiguation of "Chappaz, Cédrick"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.

Please choose a person to relate this publication to

Cédrick Lelionnais

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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.