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2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters.

, , , , , , , , , , , , , , , , , , , , , , , , , , , and . ISSCC, page 46-48. IEEE, (2020)

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