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Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors.

, , , and . Microelectron. Reliab., (2018)

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Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation., , , , , and . Microelectron. Reliab., (2017)Methodology for electromigration critical threshold design rule evaluation., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 18 (5): 576-581 (1999)Electromigration Reliability Comparison of Cu and Al Interconnects., , , , and . ISQED, page 303-308. IEEE Computer Society, (2005)Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing., , , and . IRPS, page 6. IEEE, (2015)Characterisation of defects generated during constant current InGaN-on-silicon LED operation., , , , , , , , , and . Microelectron. Reliab., (2017)Circuit Level Reliability Analysis of Cu Interconnects., , , and . ISQED, page 238-243. IEEE Computer Society, (2004)Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation., , , , , , , and . Microelectron. Reliab., (2016)Thermal aware cell-based full-chip electromigration reliability analysis., , and . ACM Great Lakes Symposium on VLSI, page 26-31. ACM, (2005)Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors., , , and . Microelectron. Reliab., (2018)Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations., , , and . Microelectron. J., 38 (4-5): 463-473 (2007)