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Circuit Level Reliability Analysis of Cu Interconnects.

S. Alam, C. Gan, C. Thompson, and D. Troxel. ISQED, page 238-243. IEEE Computer Society, (2004)

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Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.A. Lim, A. Chang, O. Yauw, B. Chylak, C. Gan, and Z. Chen. Microelectron. Reliab., 54 (11): 2555-2563 (2014)Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.A. Lim, C. Boothroyd, O. Yauw, B. Chylak, C. Gan, and Z. Chen. Microelectron. Reliab., (2016)Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop.C. Chua, H. Ong, K. Sanchez, P. Perdu, and C. Gan. Microelectron. Reliab., (2016)Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.S. Alam, C. Gan, C. Thompson, and D. Troxel. Microelectron. J., 38 (4-5): 463-473 (2007)Unsupervised learning for signal mapping in dynamic photon emission.S. Chef, S. Jacquir, K. Sanchez, P. Perdu, S. Binczak, and C. Gan. Microelectron. Reliab., 55 (9-10): 1564-1568 (2015)Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors.W. Sasangka, Y. Gao, C. Gan, and C. Thompson. Microelectron. Reliab., (2018)Embedded-EEPROM descrambling via laser-based techniques - A case study on AVR MCU.S. Chef, C. Chua, J. Tay, J. Cheah, and C. Gan. FDTC, page 1-8. IEEE, (2022)Copper micro and nano particles mixture for 3D interconnections application.Y. Dai, M. Ng, P. Anantha, C. Gan, and C. Tan. 3DIC, page TS8.9.1-TS8.9.5. IEEE, (2015)Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation.W. Sasangka, G. Syaranamual, Y. Gao, R. Made, C. Gan, and C. Thompson. Microelectron. Reliab., (2017)Magnetic field spatial Fourier analysis: A new opportunity for high resolution current localization.F. Infante, P. Perdu, H. Kor, C. Gan, and D. Lewis. Microelectron. Reliab., 51 (9-11): 1684-1688 (2011)

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Disambiguation of "Gan, Chee Lip"

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Circuit Level Reliability Analysis of Cu Interconnects.

Please choose a person to relate this publication to

Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Gan, Chee Lip"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Circuit Level Reliability Analysis of Cu Interconnects.

Please choose a person to relate this publication to

Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
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history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Circuit Level Reliability Analysis of Cu Interconnects.