( en | de | ru )

 

Disambiguation of "Gillon, Renaud"

Author of the publication

copydeleteadd this publication to your clipboard
Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging.

, , , , , , and . Microelectron. Reliab., 52 (11): 2677-2684 (2012)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Frédéric Gillon

Renaud Quekelberghe

Renaud Keriven

Otto Renaud

Renaud Quekelberghe

 

Other publications of authors with the same name

An Extended Analytic Model for the Heating of Bondwires., , , and . CoRR, (2017)A compact test structure for characterisation of leakage currents in sub-micron CMOS technologies., , , , , and . Microelectron. Reliab., 41 (12): 1939-1945 (2001)Investigation on Realistic Stuck-on/off Defects to Complement IEEE P2427 Draft Standard., , , , , and . ISQED, page 51-57. IEEE, (2022)Analog Defect Injection and Fault Simulation Techniques: A Systematic Literature Review., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 43 (1): 16-29 (January 2024)Design and Characterization of Bias Tee Used for S-parameter Characterization of Power Inductors., , , and . MIPRO, page 82-86. IEEE, (2019)DC/DC converter dead-time variation analysis and far-field radiation estimation., , , and . EMC Compo, page 7-12. IEEE, (2015)Multi-domain simulation as a foundation for the engineering of smart systems: Challenges and the SMAC vision., , , , and . ICECS, page 858-861. IEEE, (2014)Next Generation Smart Power Technologies - Challenges and Innovations Enabling Complex SoC Integration., , , , , and . ISSCC, page 296-297. IEEE, (2008)SPICE analysis of RL and RC snubber circuits for synchronous buck DC-DC converters., , , and . MIPRO, page 91-97. IEEE, (2015)Electrothermal simulation of bonding wire degradation under uncertain geometries., , , , , , and . DATE, page 1297-1302. IEEE, (2016)