Author of the publication

Capteur d'images à grande dynamique et compression intégrée pour technologie 3D.

, , , and . Traitement du Signal, 30 (6): 343-365 (2013)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

On-chip compression for HDR image sensors., , , and . DASIP, page 176-182. IEEE, (2010)A 3T or 4T pixel compatible DR extension technique suitable for 3D-IC imagers: A 800×512 and 5μm pixel pitch 2D demonstrator., , , , , , , and . ISCAS, page 1094-1097. IEEE, (2015)Capteur d'images à grande dynamique et compression intégrée pour technologie 3D., , , and . Traitement du Signal, 30 (6): 343-365 (2013)Systemc modelization for fast validation of imager architectures., , and . DASIP, page 341-345. IEEE, (2011)Benefits of three-dimensional circuit stacking for image sensors., , , and . NEWCAS, page 1-4. IEEE, (2013)A 3T or 4T pixel compatible DR extension technique suitable for 3D-IC imagers: A 800×512 and 5μm pixel pitch 2D demonstrator., , , , , , , and . ISCAS, page 1094-1097. IEEE, (2015)High Dynamic Range image sensor with self adapting integration time in 3D technology., , , and . ICECS, page 340-343. IEEE, (2012)A novel 3D architecture for high-dynamic range image sensor and on-chip data compression., , , and . Sensors, Cameras, and Systems for Industrial, Scientific, and Consumer Applications, volume 7875 of SPIE Proceedings, page 78750T. SPIE, (2011)