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Improving the reliability of SRAM-based PUFs in the presence of aging., , , , , и . DTIS, стр. 1-6. IEEE, (2020)A detailed, cell-by-cell look into the effects of aging on an SRAM PUF using a specialized test array., , , , , и . SMACD, стр. 1-4. IEEE, (2023)A Model Parameter Extraction Methodology Including Time-Dependent Variability for Circuit Reliability Simulation., , , , , , , , и . SMACD, стр. 53-56. IEEE, (2018)Automated Massive RTN Characterization Using a Transistor Array Chip., , , , , , , , и . SMACD, стр. 29-32. IEEE, (2018)A Ring-Oscillator-Based Degradation Monitor Concept with Tamper Detection Capability., , , , , и . IRPS, стр. 1-7. IEEE, (2022)TiDeVa: A Toolbox for the Automated and Robust Analysis of Time-Dependent Variability at Transistor Level., , , , , , , и . SMACD, стр. 197-200. IEEE, (2019)New method for the automated massive characterization of Bias Temperature Instability in CMOS transistors., , , , , , , и . DATE, стр. 150-155. IEEE, (2019)Using dedicated device arrays for the characterization of TDDB in a scaled HK/MG technology., , , , , и . IRPS, стр. 1-6. IEEE, (2023)Challenges and solutions to the defect-centric modeling and circuit simulation of time-dependent variability., , , , , , , и . IRPS, стр. 1-9. IEEE, (2023)Design Considerations of an SRAM Array for the Statistical Validation of Time-Dependent Variability Models., , , , , , , , , и 2 other автор(ы). SMACD, стр. 73-76. IEEE, (2018)