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Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.

, , , , , и . 3DIC, стр. 1-4. IEEE, (2010)

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Wook Lee

Wook Lee

Hae Wook Lee

Myung-Wook Lee

Sang-Wook Lee

 

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