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Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.

A. Noriki, K. Lee, J. Bea, T. Fukushima, T. Tanaka, and M. Koyanagi. 3DIC, page 1-4. IEEE, (2010)

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Akihiro Hamano

Akihiro Sato

Akihiro Onagi

Other publications of authors with the same name

Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration.J. Bea, M. Murugesan, Y. Ohara, A. Noriki, H. Kino, K. Lee, T. Fukushima, T. Tanaka, and M. Koyanagi. 3DIC, page 1-5. IEEE, (2009)Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors.A. Noriki, I. Tamai, Y. Ibusuki, A. Ukita, S. Suda, K. Takemura, D. Shimura, Y. Onawa, H. Yaegashi, and T. Amano. ECOC, page 1-4. IEEE, (2020)10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.Y. Ohara, A. Noriki, K. Sakuma, K. Lee, M. Murugesan, J. Bea, F. Yamada, T. Fukushima, T. Tanaka, and M. Koyanagi. 3DIC, page 1-6. IEEE, (2009)Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI.A. Noriki, K. Lee, J. Bea, T. Fukushima, T. Tanaka, and M. Koyanagi. 3DIC, page 1-4. IEEE, (2011)Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate.T. Amano, A. Noriki, I. Tamai, Y. Ibusuki, A. Ukita, S. Suda, T. Kurosu, K. Takemura, T. Aoki, D. Shimura and 2 other author(s). OFC, page 1-3. IEEE, (2021)Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.A. Noriki, K. Lee, J. Bea, T. Fukushima, T. Tanaka, and M. Koyanagi. 3DIC, page 1-4. IEEE, (2010)Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror.A. Noriki, I. Tamai, Y. Ibusuki, A. Ukita, S. Suda, D. Shimura, Y. Onawa, H. Yaegashi, and T. Amano. 3DIC, page 1-4. IEEE, (2019)Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers.K. Takemura, A. Ukita, Y. Ibusuki, M. Kurihara, A. Noriki, T. Amano, D. Okamoto, Y. Suzuki, and K. Kurata. 3DIC, page 1-6. IEEE, (2019)

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Disambiguation of "Noriki, Akihiro"

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Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.

Please choose a person to relate this publication to

Akihiro Hamano

Akihiro Sato

Akihiro Onagi

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Noriki, Akihiro"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.

Please choose a person to relate this publication to

Akihiro Hamano

Akihiro Sato

Akihiro Onagi

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
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URL
DOI
BibTeX
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APA
Chicago
DIN 1505
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Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.