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Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal., , , , , , , , , and 6 other author(s). OFC, page 1-3. IEEE, (2023)Robust BEOL MIMCAP for Long and Controllable TDDB Lifetime., , , , and . IRPS, page 1-3. IEEE, (2019)Heuristic Evaluation for Augmentative and Alternative Communication Application: A Case Study., , and . ICTC, page 1240-1243. IEEE, (2021)Reliability challenges for 2.5D/3D integration: An overview., , , , , and . IRPS, page 5. IEEE, (2018)Effect of metal line width on electromigration of BEOL Cu interconnects., , , , , , , , , and 1 other author(s). IRPS, page 4. IEEE, (2018)Development of Bipolar Electrostatic Chuck with a Beam-Array Assembly Fabricated by Lithography., , , , , and . Int. J. Autom. Technol., 16 (4): 471-477 (2022)Nickel Silicide Electromigration on Micro Ring Modulators for Silicon Photonics Technology., , and . IRPS, page 1-8. IEEE, (2023)Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects., , , , , , and . IRPS, page 1-5. IEEE, (2021)