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Rate and Complexity-Aware Coding Scheme for Fixed-Camera Videos Based on Region-of-Interest Detection.

, , , , , и . WebMedia, стр. 409-412. ACM, (2017)

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Cristiano Pereira

Cristiano Bertolini

Cristiano Micheli

Cristiano Bettega

Cristiano Niclass

 

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Objective and Subjective Video Quality Assessment in Mobile Devices for Low-Complexity H.264/AVC Codecs., , , , , , , и . WebMedia, стр. 429-432. ACM, (2017)Incremental timing optimization for automatic layout generation., , , и . ISCAS (4), стр. 3567-3570. IEEE, (2005)Efficient timing closure with a transistor level design flow., , , , и . VLSI-SoC, стр. 312-315. IEEE, (2007)A Comparison of Layout Implementations of Pipelined and Non-Pipelined Signed Radix-4 Array Multiplier and Modified Booth Multiplier Architectures., , , , , , , и . VLSI-SoC, том 240 из IFIP, стр. 25-39. Springer, (2005)Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits., , , , , , , , , и 6 other автор(ы). IEEE Des. Test, 33 (3): 21-36 (2016)Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes., , , , , , и . 3DIC, стр. 1-5. IEEE, (2016)A New Transistor-Level Layout Generation Strategy for Static CMOS Circuits., , и . ICECS, стр. 660-663. IEEE, (2006)Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells., , , , , , , , , и 2 other автор(ы). ISVLSI, стр. 539-544. IEEE Computer Society, (2017)Using TSVs for thermal mitigation in 3D circuits: Wish and truth., , , , , , , , , и 1 other автор(ы). 3DIC, стр. 1-8. IEEE, (2014)Graphite-based heat spreaders for hotspot mitigation in 3D ICs., , , , , и . 3DIC, стр. TS10.4.1-TS10.4.4. IEEE, (2015)