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Wafer-Level Contactless Testing Based on UHF RFID Tags With Post-Process On-Chip Antennas., , , , , and . IEEE Trans. Circuits Syst. II Express Briefs, 65-II (10): 1355-1359 (2018)An Evolutionary Algorithm Approach to Stress Program Generation During Burn-In., , , , , , , , , and 1 other author(s). J. Low Power Electron., 14 (1): 86-98 (2018)A comprehensive methodology for stress procedures evaluation and comparison for Burn-In of automotive SoC., , , , , , , , , and 2 other author(s). DATE, page 646-649. IEEE, (2017)A fully contactless wafer-level testing for UHF RFID tag with on-chip antenna., , , , and . DTIS, page 1-6. IEEE, (2018)New R&R Methodology in Semiconductor Manufacturing Electrical Testing., , , and . ITC, page 410-419. IEEE, (2022)Main Parasitic Effects in Contactless Wafer Testing., , , , and . ApplePies, page 69-76. Springer, (2018)Electro Optical Terahertz Pulse Reflectometry, a non destructive technique to localize defects on various type of package., , , , , , , , and . Microelectron. Reliab., 54 (9-10): 2075-2080 (2014)