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Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology.

, , , , , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 2 (2): 295-306 (2012)

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Using 3D integration technology to realize multi-context FPGAs., , , , , , and . FPL, page 507-510. IEEE, (2009)3D configuration caching for 2D FPGAs., , , , , , and . FPGA, page 286. ACM, (2009)Field Programmable Compressor Trees: Acceleration of Multi-Input Addition on FPGAs., , , , , , , , , and . ACM Trans. Reconfigurable Technol. Syst., 2 (2): 13:1-13:36 (2009)Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology., , , , , , and . IEEE J. Emerg. Sel. Topics Circuits Syst., 2 (2): 295-306 (2012)3D-MMC: a modular 3D multi-core architecture with efficient resource pooling., , , , , and . DATE, page 1241-1246. EDA Consortium San Jose, CA, USA / ACM DL, (2013)A flexible DSP block to enhance FPGA arithmetic performance., , , , , and . FPT, page 70-77. IEEE Computer Society, (2009)Design and feasibility of multi-Gb/s quasi-serial vertical interconnects based on TSVs for 3D ICs., , , and . VLSI-SoC, page 149-154. IEEE, (2010)Architectural improvements for field programmable counter arrays: enabling efficient synthesis of fast compressor trees on FPGAs., , , , , , , and . FPGA, page 181-190. ACM, (2008)Memory organization and data layout for instruction set extensions with architecturally visible storage., , , and . ICCAD, page 689-696. ACM, (2009)