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Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration.

, , , , , , , , и . 3DIC, стр. 1-7. IEEE, (2011)

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Chisaburo Yamada

Osamu Yamada

Hitoshi Yamada

Keiichi Yamada

Peter Fumiaki Momose

 

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Robust control of active suspension to improve ride comfort with structural constraints., , , , и . AMC, стр. 103-108. IEEE, (2016)Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack., , , , , , , , , и 1 other автор(ы). 3DIC, стр. 1-8. IEEE, (2013)Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration., , , , , , , , и . 3DIC, стр. 1-7. IEEE, (2011)Advanced 3D chip stack process for thin dies with fine pitch bumps using pre-applied inter chip fill., и . 3DIC, стр. 1-4. IEEE, (2009)Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package., , , , , , , , и . 3DIC, стр. 1-6. IEEE, (2011)High density 3D integration by pre-applied Inter Chip Fill., , , , , , , , и . 3DIC, стр. 1-5. IEEE, (2010)Thermo-mechanical evaluation of 3D packages., , , , , , и . 3DIC, стр. 1-4. IEEE, (2013)Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack., , , и . 3DIC, стр. 1-5. IEEE, (2009)10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack., , , , , , , , , и . 3DIC, стр. 1-6. IEEE, (2009)