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Disambiguation of "Yamada, Fumiaki"

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10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.

, , , , , , , , , and . 3DIC, page 1-6. IEEE, (2009)

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Chisaburo Yamada

Osamu Yamada

Hitoshi Yamada

Keiichi Yamada

Peter Fumiaki Momose

 

Other publications of authors with the same name

Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack., , , and . 3DIC, page 1-5. IEEE, (2009)Thermo-mechanical evaluation of 3D packages., , , , , , and . 3DIC, page 1-4. IEEE, (2013)10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack., , , , , , , , , and . 3DIC, page 1-6. IEEE, (2009)Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack., , , , , , , , , and 1 other author(s). 3DIC, page 1-8. IEEE, (2013)Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration., , , , , , , , and . 3DIC, page 1-7. IEEE, (2011)Robust control of active suspension to improve ride comfort with structural constraints., , , , and . AMC, page 103-108. IEEE, (2016)High density 3D integration by pre-applied Inter Chip Fill., , , , , , , , and . 3DIC, page 1-5. IEEE, (2010)Combination between the nonlinear finite element analyses and the strain measurement using the digital image correlation for a new 3D SIC package., , , , , , , , and . 3DIC, page 1-6. IEEE, (2011)Advanced 3D chip stack process for thin dies with fine pitch bumps using pre-applied inter chip fill., and . 3DIC, page 1-4. IEEE, (2009)