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10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.

, , , , , , , , , и . 3DIC, стр. 1-6. IEEE, (2009)

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Kalaimathi Murugesan

Aruljothi Mariappan

Mariappan Sakthivel

Malaiyalam Mariappan

Manju Shrii Murugesan

 

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