Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Multicore-Fiber LC Receptacle with Compact Fan-in/Fan-out for Short-Reach Transceivers., , , , , , , , , and . OFC, page 1-3. IEEE, (2018)Tapered Self-Written Waveguide between Silicon Photonics Chip and Standard Single-Mode Fiber., , , , , and . OFC, page 1-3. IEEE, (2020)17.4 Environmentally-Friendly Disposable Circuit and Battery System for Reducing Impact of E-Wastes., , , , , , , , , and 4 other author(s). ISSCC, page 320-322. IEEE, (2024)A 25-Gbps × 4 ch, Low-Power Compact Wire-Bond-Free 3D-Stacked Transmitter Module with 1.3-μm LD-Array-on-Si for On-Board Optics., , , , , , , , , and 3 other author(s). OFC, page 1-3. IEEE, (2019)Field reliability of silica-based PLC splitter for FTTH.. OFC, page 1-3. IEEE, (2015)WDM transmission in 1.0µm band over PCF using supercontinuum source., , , , , and . IEICE Electron. Express, 5 (11): 395-399 (2008)Highly Reliable Silica-LiNbO3 Hybrid Modulator Using Heterogeneous Material Integration Technology., , , , , , , , , and . IEICE Trans. Electron., 103-C (8): 353-361 (2020)Miniature Optical Connector with Magnetic Physical Contact., , , , and . OFC, page 1-3. IEEE, (2020)A 137-mW, 4 ch × 25-Gbps Low-Power Compact Transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si., , , , , , , , , and 5 other author(s). OFC, page 1-3. IEEE, (2018)Low-loss fiber-bundle-type fan-in/fan-out device for 6-mode 19-core fiber., , , and . OFC, page 1-3. IEEE, (2017)