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A 3T or 4T pixel compatible DR extension technique suitable for 3D-IC imagers: A 800×512 and 5μm pixel pitch 2D demonstrator., , , , , , , и . ISCAS, стр. 1094-1097. IEEE, (2015)Benefits of three-dimensional circuit stacking for image sensors., , , и . NEWCAS, стр. 1-4. IEEE, (2013)Pixel-level ADC by small charge quantum counting., , , , и . ICECS, стр. 423-426. IEEE, (2006)A photovoltaic mode pixel Embedding energy harvesting capability For future self-powered image sensors., , и . NEWCAS, стр. 261-264. IEEE, (2018)Systemc modelization for fast validation of imager architectures., , и . DASIP, стр. 341-345. IEEE, (2011)Capteur d'images à grande dynamique et compression intégrée pour technologie 3D., , , и . Traitement du Signal, 30 (6): 343-365 (2013)Performances of an highly parallel image processing chain for capturing high dynamic range video., , , , и . ICECS, стр. 403-406. IEEE, (2014)On compensating unknown pixel behaviors for image sensors with embedded processing., , , , и . ACSSC, стр. 933-937. IEEE, (2014)Design optimization for low light CMOS image sensors readout chain., , , и . NEWCAS, стр. 241-244. IEEE, (2014)Correlated Multiple Sampling impact analysis on 1/fE noise for image sensors., и . IMSE, стр. 1-6. Society for Imaging Science and Technology, (2019)