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Disambiguation of "Bakir, Muhannad S."

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A Model Study of Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication in 2.5D Integration.

, , , and . VLSI-SOC, page 159-164. IEEE, (2020)

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Muhannad Ababneh

Muhannad Mahmoud

Muhannad Alkassar

Bakir Awamy

Muhannad Jumaa

 

Other publications of authors with the same name

Design Space Exploration of Power Delivery For Advanced Packaging Technologies., , , , , and . CoRR, (2020)H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention., , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 31 (10): 1592-1602 (October 2023)Multilevel Signaling for High-Speed Chiplet-to-Chiplet Communication., , , and . VLSI-SoC (Selected Papers), volume 621 of IFIP Advances in Information and Communication Technology, page 149-178. Springer, (2020)3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation., , , , , , , and . CICC, page 663-670. IEEE, (2008)Coaxial polymer pillars: ultra-low inductance compliant wafer-level electrical input/output interconnects for power distribution., , and . SoCC, page 78-81. IEEE, (2004)Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation., , and . 3DIC, page 1-5. IEEE, (2014)Evaluation of 3DICs and fabrication of monolithic interlayer vias., , and . 3DIC, page 1-6. IEEE, (2013)Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs., , and . 3DIC, page 1-6. IEEE, (2013)Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes., , , , , , and . BioCAS, page 1-4. IEEE, (2017)High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating., , , and . 3DIC, page 1-4. IEEE, (2019)