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Energy-Efficient Abundant-Data Computing: The N3XT 1, 000x., , , , , , , , , and 10 other author(s). Computer, 48 (12): 24-33 (2015)TPAD: Hardware Trojan Prevention and Detection for Trusted Integrated Circuits., , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 35 (4): 521-534 (2016)A Uniform Latency Model for DNN Accelerators with Diverse Architectures and Dataflows., , , , , and . DATE, page 220-225. IEEE, (2022)Co-Optimization of SRAM Circuits with Sequential Access Patterns in a 7nm SoC Achieving 58% Memory Energy Reduction for AR Applications., , , , , , , and . VLSI Technology and Circuits, page 216-217. IEEE, (2022)11.2 A 3D integrated Prototype System-on-Chip for Augmented Reality Applications Using Face-to-Face Wafer Bonded 7nm Logic at <2μm Pitch with up to 40% Energy Reduction at Iso-Area Footprint., , , , , , , , , and 3 other author(s). ISSCC, page 210-212. IEEE, (2024)TPAD: Hardware Trojan Prevention and Detection for Trusted Integrated Circuits., , , , , and . CoRR, (2015)3D nanosystems enable embedded abundant-data computing: special session paper., , , , , , , and . CODES+ISSS, page 29:1-29:2. ACM, (2017)Monolithic 3D integration: a path from concept to reality., , , , , and . DATE, page 1197-1202. ACM, (2015)Evaluation of Low-Voltage SRAM for Error-Resilient Augmented Reality Applications., , , and . SiPS, page 1-3. IEEE, (2021)A QDI Interconnect for 3D Systems Using Industry Standard EDA and Cell Libraries., , , , and . ASYNC, page 58-59. IEEE, (2023)