%0 Journal Article %1 journals/mr/FioriGJT13 %A Fiori, Vincent %A Gallois-Garreignot, Sébastien %A Jaouen, Hervé %A Tavernier, Clément %D 2013 %J Microelectron. Reliab. %K dblp %N 2 %P 229-235 %T Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. %U http://dblp.uni-trier.de/db/journals/mr/mr53.html#FioriGJT13 %V 53

@article{journals/mr/FioriGJT13, added-at = {2021-10-14T00:00:00.000+0200}, author = {Fiori, Vincent and Gallois-Garreignot, Sébastien and Jaouen, Hervé and Tavernier, Clément}, biburl = {https://www.bibsonomy.org/bibtex/2dde13113e1c10fc9af65ccd60dde6d8b/dblp}, ee = {https://doi.org/10.1016/j.microrel.2012.08.015}, interhash = {09d934de00d713470cc1b9902f069b90}, intrahash = {dde13113e1c10fc9af65ccd60dde6d8b}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 2, pages = {229-235}, timestamp = {2024-04-09T02:50:51.000+0200}, title = {Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr53.html#FioriGJT13}, volume = 53, year = 2013 }