%0 Conference Paper %1 conf/3dic/LeeTMNBFTK13 %A Lee, Kang Wook %A Tanikawa, Seiya %A Murugesan, Mariappan %A Naganuma, H. %A Bea, Jichoel %A Fukushima, Takafumi %A Tanaka, Tetsu %A Koyanagi, Mitsumasa %B 3DIC %D 2013 %I IEEE %K dblp %P 1-4 %T Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#LeeTMNBFTK13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/LeeTMNBFTK13, added-at = {2021-02-16T00:00:00.000+0100}, author = {Lee, Kang Wook and Tanikawa, Seiya and Murugesan, Mariappan and Naganuma, H. and Bea, Jichoel and Fukushima, Takafumi and Tanaka, Tetsu and Koyanagi, Mitsumasa}, biburl = {https://www.bibsonomy.org/bibtex/2f2c169f662b0e084c0b6e0c375d87bf3/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702336}, interhash = {c8b98c2f903a41055d8b64e4e3424952}, intrahash = {f2c169f662b0e084c0b6e0c375d87bf3}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:52.000+0200}, title = {Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#LeeTMNBFTK13}, year = 2013 }