%0 Conference Paper %1 conf/icicdt/VandoorenWFMPWW18 %A Vandooren, A. %A Witters, Liesbeth %A Franco, Jacopo %A Mallik, Arindam %A Parvais, Bertrand %A Wu, Z. %A Walke, Amey %A Deshpande, V. %A Rosseel, E. %A Hikavyy, Andriy %A Li, W. %A Peng, L. %A Rassoul, Nouredine %A Jamieson, Geraldine %A Inoue, Fumihiro %A Verbinnen, G. %A Devriendt, Katia %A Teugels, Lieve %A Heylen, N. %A Vecchio, E. %A Zheng, T. %A Waldron, Niamh %A Heyn, Vincent De %A Mocuta, Dan %A Collaert, Nadine %B ICICDT %D 2018 %I IEEE %K dblp %P 145-148 %T Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling. %U http://dblp.uni-trier.de/db/conf/icicdt/icicdt2018.html#VandoorenWFMPWW18 %@ 978-1-5386-2550-7

@inproceedings{conf/icicdt/VandoorenWFMPWW18, added-at = {2023-09-30T00:00:00.000+0200}, author = {Vandooren, A. and Witters, Liesbeth and Franco, Jacopo and Mallik, Arindam and Parvais, Bertrand and Wu, Z. and Walke, Amey and Deshpande, V. and Rosseel, E. and Hikavyy, Andriy and Li, W. and Peng, L. and Rassoul, Nouredine and Jamieson, Geraldine and Inoue, Fumihiro and Verbinnen, G. and Devriendt, Katia and Teugels, Lieve and Heylen, N. and Vecchio, E. and Zheng, T. and Waldron, Niamh and Heyn, Vincent De and Mocuta, Dan and Collaert, Nadine}, biburl = {https://www.bibsonomy.org/bibtex/25359687e0e3058ee00c355a6b2113bc6/dblp}, booktitle = {ICICDT}, crossref = {conf/icicdt/2018}, ee = {https://doi.org/10.1109/ICICDT.2018.8399777}, interhash = {e509bc6dfa6d158a9116cd46625ac837}, intrahash = {5359687e0e3058ee00c355a6b2113bc6}, isbn = {978-1-5386-2550-7}, keywords = {dblp}, pages = {145-148}, publisher = {IEEE}, timestamp = {2024-04-10T21:06:06.000+0200}, title = {Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling.}, url = {http://dblp.uni-trier.de/db/conf/icicdt/icicdt2018.html#VandoorenWFMPWW18}, year = 2018 }