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Area-I/O Flip-Chip Routing for Chip-Package Co-Design Considering Signal Skews., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 29 (5): 711-721 (2010)ECO Timing Optimization Using Spare Cells and Technology Remapping., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 29 (5): 697-710 (2010)Flip-chip routing with unified area-I/O pad assignments for package-board co-design., , and . DAC, page 336-339. ACM, (2009)A routing algorithm for flip-chip design., , , , and . ICCAD, page 753-758. IEEE Computer Society, (2005)Modeling Gamer Quality-of-Experience Using a Real Cloud VR Gaming Testbed., , , and . MMVE@MMSys, page 12-17. ACM, (2023)Enhancing situational awareness with adaptive firefighting drones: leveraging diverse media types and classifiers., , , , and . MMSys, page 279-286. ACM, (2022)A Network-Flow-Based RDL Routing Algorithmz for Flip-Chip Design., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 26 (8): 1417-1429 (2007)Optimal Camera Placement for 6 Degree-of-Freedom Immersive Video Streaming Without Accessing 3D Scenes., , , , , and . IXR@MM, page 31-39. ACM, (2022)Routing for chip-package-board co-design considering differential pairs., , and . ICCAD, page 512-517. IEEE Computer Society, (2008)Area-I/O flip-chip routing for chip-package co-design., and . ICCAD, page 518-522. IEEE Computer Society, (2008)