( en | de | ru )

 

Disambiguation of "Kamal, Mehdi"

Author of the publication

copydeleteadd this publication to your clipboard
Circuit-Level Techniques for Logic and Memory Blocks in Approximate Computing Systemsx.

, , , and . Proc. IEEE, 108 (12): 2150-2177 (2020)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Malika Mehdi

Ahmad Mehdizadeh

Majid Mehdikhani

Arash Mehdiani

Syed Atif Mehdi

 

Other publications of authors with the same name

An energy and area efficient yet high-speed square-root carry select adder structure., , , and . Comput. Electr. Eng., (2017)An efficient network on-chip architecture based on isolating local and non-local communications., , , and . Comput. Electr. Eng., (2015)CL-CPA: A hybrid carry-lookahead/carry-propagate adder for low-power or high-performance operation mode., , , , and . Integr., (2017)Design of NBTI-resilient extensible processors., , , and . Integr., (2015)An efficient temperature dependent hot carrier injection reliability simulation flow., , , , and . Microelectron. Reliab., (2016)RandShift: An Energy-Efficient Fault-Tolerant Method in Secure Nonvolatile Main Memory., , , and . IEEE Trans. Very Large Scale Integr. Syst., 28 (1): 287-291 (2020)Improving efficiency of extensible processors by using approximate custom instructions., , , and . DATE, page 1-4. European Design and Automation Association, (2014)CupCarbon: a multi-agent and discrete event wireless sensor network design and simulation tool., , , and . SimuTools, page 126-131. ICST/ACM, (2014)TheSPoT: Thermal Stress-Aware Power and Temperature Management for Multiprocessor Systems-on-Chip., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 37 (8): 1532-1545 (2018)ACHILLES: Accuracy-Aware High-Level Synthesis Considering Online Quality Management., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 38 (8): 1452-1465 (2019)