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Disambiguation of "Moreau, Stéphane"

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A new experimental methodology using point deflection to quantify residual stress of thin polymer membrane materials in MEMS devices.

, , , , , , , , and . NEMS, page 486-489. IEEE, (2013)

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Stéphane Müller

Stéphane Haussler

Stéphane Klein

Stéphane Aubry

Stéphane Audière

 

Other publications of authors with the same name

200°C direct bonding copper interconnects : Electrical results and reliability., , , , , and . 3DIC, page 1-4. IEEE, (2011)Comparative study of thermal cycling and thermal shocks tests on electronic components reliability., , and . Microelectron. Reliab., 44 (9-11): 1343-1347 (2004)MetaSurv: Web-Platform Generator for the Monitoring of Health Indicators and Interactive Geographical Information System., , and . MIE, volume 116 of Studies in Health Technology and Informatics, page 989-993. IOS Press, (2005)Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding., , , , , , , , , and . 3DIC, page 1-8. IEEE, (2014)A new experimental methodology using point deflection to quantify residual stress of thin polymer membrane materials in MEMS devices., , , , , , , , and . NEMS, page 486-489. IEEE, (2013)Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2., , , and . Microelectron. Reliab., 42 (9-11): 1663-1666 (2002)Effects of Boundary Conditions in Fully Convolutional Networks for Learning Spatio-Temporal Dynamics., , , , and . ECML/PKDD (5), volume 12979 of Lecture Notes in Computer Science, page 102-117. Springer, (2021)Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution., , , , , , , and . ISPD, page 124-132. ACM, (2023)Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence., , , , , , , , , and . Microelectron. Reliab., 55 (8): 1205-1213 (2015)Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits., , , , , , and . IRPS, page 1-7. IEEE, (2023)