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Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding.

Y. Beilliard, S. Moreau, L. Cioccio, P. Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P. Jouneau, E. Rolland, and T. Signamarcheix. 3DIC, page 1-8. IEEE, (2014)

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Romano Pool

Romano Pocai

Romano Fanzutti

Romano Grohmann

Romano Gregorig

Other publications of authors with the same name

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.E. Bourjot, P. Stewart, C. Dubarry, E. Lagoutte, E. Rolland, N. Bresson, G. Romano, D. Scevola, V. Balan, J. Dechamp and 7 other author(s). 3DIC, page 1-5. IEEE, (2019)Galois : An order-theoretic approach to conceptual clusteringC. Carpineto, and G. Romano. Proceedings of the 10th International Conference on Machine Learning (ICML'90), page 33--40. (July 1993)Precise EOT regrowth extraction enabling performance analysis of low temperature extension first devices.J. Micout, Q. Rafhay, X. Garros, M. Cassé, J. Coignus, L. Pasini, C. Lu, N. Rambal, C. Fenouillet-Béranger, L. Brunet and 5 other author(s). ESSDERC, page 144-147. IEEE, (2017)Concept Data AnalysisC. Carpineto, and G. Romano. Wiley, (2004)Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding.Y. Beilliard, S. Moreau, L. Cioccio, P. Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P. Jouneau, E. Rolland, and T. Signamarcheix. 3DIC, page 1-8. IEEE, (2014)Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration.T. Frutuoso, X. Garros, P. Batude, L. Brunet, J. Lacord, B. Sklénard, V. Lapras, C. Fenouillet-Béranger, M. Ribotta, A. Magalhaes-Lucas and 8 other author(s). VLSI Technology and Circuits, page 332-333. IEEE, (2022)Heat spreading packaging solutions for hybrid bonded 3D-ICs.R. Prieto, P. Coudrain, J. Colonna, Y. Hallez, C. Chancel, V. Rat, S. Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat and 2 other author(s). 3DIC, page 1-6. IEEE, (2016)Aplicación Integrada de la Biblioteca Digital del Patrimonio Histórico Andaluz.M. Escalona, M. Mejías, J. Torres, J. Cordero, and M. Romano. JBIDI, (2000)ASTRA: A Service to Access Databases over the EARN Network.L. Abba, S. Giordano, G. Romano, S. Trumpy, and D. Vannozzi. Computer Networks and ISDN Systems, 19 (3-5): 350-355 (1990)An Approach to Hypertext Presentations on the World Wide Web.N. Aloia, S. Giuliano, and G. Romano. DEXA Workshop, page 76-81. IEEE Computer Society, (1996)

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Disambiguation of "Romano, G."

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Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding.

Please choose a person to relate this publication to

Romano Pool

Romano Pocai

Romano Fanzutti

Romano Grohmann

Romano Gregorig

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Romano, G."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding.

Please choose a person to relate this publication to

Romano Pool

Romano Pocai

Romano Fanzutti

Romano Grohmann

Romano Gregorig

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding.