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A component decomposition preconditioning for 3D stress analysis problems., и . Numerical Lin. Alg. with Applic., 9 (6-7): 567-583 (2002)Parallel Simulation of Coupled Oxidation and Diffusion in VLSI Wafer-Fabrication., , и . PARCO, стр. 211-215. (1997)A new finite element approach to stress analysis in microfabrication technology.. Microelectron. Reliab., 41 (6): 837-845 (2001)Exponentially fitted discretization schemes for diffusion process simulation on coarse grids.. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 15 (5): 484-492 (1996)Efficiency Study of the "Black-Box" Component Decomposition Preconditioning for Discrete Stress Analysis Problems., и . International Conference on Computational Science, том 3037 из Lecture Notes in Computer Science, стр. 97-104. Springer, (2004)Extraction and modeling of self-heating and mutual thermal coupling impedance of bipolar transistors., , , , , , и . IEEE J. Solid State Circuits, 39 (10): 1764-1772 (2004)Multigrid Methods., и . Wiley Encyclopedia of Computer Science and Engineering, John Wiley & Sons, Inc., (2008)