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Extraction and modeling of self-heating and mutual thermal coupling impedance of bipolar transistors.

, , , , , , and . IEEE J. Solid State Circuits, 39 (10): 1764-1772 (2004)

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Dynamic electrothermal macromodeling techniques for thermal-aware design of circuits and systems., , , , and . PATMOS, page 227-230. IEEE, (2013)Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers., , , and . Microelectron. Reliab., 53 (9-11): 1471-1475 (2013)3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditions., , , , , , and . Microelectron. Reliab., 54 (9-10): 1845-1850 (2014)Extraction and modeling of self-heating and mutual thermal coupling impedance of bipolar transistors., , , , , , and . IEEE J. Solid State Circuits, 39 (10): 1764-1772 (2004)Advanced thermal simulation of SiGe: C HBTs including back-end-of-line., , , , and . Microelectron. Reliab., (2016)Partition-based approach to parametric dynamic compact thermal modeling., , , , , , and . Microelectron. Reliab., (2017)Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations., , , , , , and . Microelectron. Reliab., 53 (9-11): 1713-1718 (2013)Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications., , , , , , , , , and 8 other author(s). Proc. IEEE, 105 (6): 1035-1050 (2017)Investigating the Impact of Cracks on Solar Cells Performance: Analysis Based on Nonuniform and Uniform Crack Distributions., , and . IEEE Trans. Ind. Informatics, 18 (3): 1684-1693 (2022)Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction., , , and . Microelectron. J., 46 (12): 1129-1137 (2015)