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Disambiguation of "Lim, Sung Kyu"

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Frequency and time domain analysis of power delivery network for monolithic 3D ICs.

, , , , , and . ISLPED, page 1-6. IEEE, (2017)

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Sung-Ki Lim

Yong-Sung Lim

Han-Sung Lim

Sung-Kyu Hong

Sung-Yeun Lim

 

Other publications of authors with the same name

Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs., , , , , and . DATE, page 37-42. IEEE, (2020)Clock Delivery Network Design and Analysis for Interposer-Based 2.5-D Heterogeneous Systems., , , , , , , and . IEEE Trans. Very Large Scale Integr. Syst., 29 (4): 605-616 (2021)Distributed TSV Topology for 3-D Power-Supply Networks., and . IEEE Trans. Very Large Scale Integr. Syst., 20 (11): 2066-2079 (2012)Die-to-Die Parasitic Extraction Targeting Face-to-Face Bonded 3D ICs., and . J. Inform. and Commun. Convergence Engineering, (2015)Guest Editors' Introduction: Advances in 3-D Integrated Circuits, Systems, and CAD Tools - Part 2., and . IEEE Des. Test, 33 (2): 7-8 (2016)Exploration of temperature-aware refresh schemes for 3D stacked eDRAM caches., , , and . Microprocess. Microsystems, (2016)MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration., , , , , , , , and . CoRR, (2021)TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 31 (8): 1194-1207 (2012)Retiming-based timing analysis with an application to mincut-based global placement., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 23 (12): 1684-1692 (2004)Edge separability-based circuit clustering with application to multilevel circuit partitioning., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 23 (3): 346-357 (2004)